تاثیردما و زمان اتصال دهی بر ریزساختار سیستم GTD-111/BNi-3/GTD-111 به روش فاز مایع گذرا(TLP)

نوع مقاله : مقاله پژوهشی

نویسندگان

1 استاد گروه مهندسی مواد و متالورژی دانشگاه فردوسی مشهد

2 گروه مهندسی و علم مواد، مهندسی، فردوسی مشهد، مشهد ایران

3 دانشکده مهندسی معدن و متالورژی، دانشگاه صنعتی امیرکبیر، تهران، ایران

چکیده

در این مقاله تاثیر دما و زمان اتصال­دهی بر ریزساختار اتصال فاز مایع گذرای سوپرآلیاژ پایه نیکل GTD-111 مورد مطالعه و بررسی قرار گرفته است. فرایند اتصال­­دهی در دماهای1080، 1120 و °C1160 در زمان­های مختلف انجام گردید و ریزساختار نواحی مختلف اتصال توسط میکروسکوپ نوری و الکترونی روبشی مورد بررسی و تحلیل قرار گرفت. نتایج نشان داد که با افزایش دمای اتصال­دهی از 1080 تا °C1160، زمان انجماد کامل همدما از 195 تا 90 دقیقه کاهش و مقدار انحلال فلز پایه و پهنای درز اتصال افزایش یافته است. همچنین در همه زمان­های نگه­داری، ناحیه­ی اتصال حاوی فازهای ثانویه شامل بوریدهای غنی از نیکل و کروم و سیلیسید نیکل در یک زمینه­ی g بود. این فازها در قسمت­های مرکزی و مجاور  فصل­مشترک فلز پایه - اتصال مشاهده شد. مشخص شد که با افزایش زمان اتصال­دهی تا انجماد کامل همدما، کسر حجمی ذرات رسوبی ناحیه­ی اتصال کاهش یافته و اجزای بوریدی ترد به­طور کامل حذف شده­اند. لازم به ذکر است، این فرایند ناشی از وابستگی شدید رفتار سینتیک نفوذی این نوع اتصالات به دما و زمان می­باشد. علاوه بر این، مشاهده شد، با افزایش دمای اتصال­دهی وسعت ناحیه­ی اتصال و میزان انحلال فلز پایه افزایش می­یابد. همچنین نتایج نشان داد که با افزایش زمان نگه­داری در هر سه دمای اتصال­دهی تا زمان تکمیل انجماد همدمای کامل، ضخامت منطقه­ی ASZ و کسر حجمی رسوبات در ناحیه­ی اتصال کاهش و طول ناحیه­ی DAZ  افزایش می­یابد. با توجه به اینکه دمای بحرانی در آلیاژ مورد مطالعه °C1180 می­باشد، جهت یکنواختی و همگن­سازی ریزساختار اتصالات در شرایط مختلف، عملیات حرارتی بعد از اتصال­دهی در دمای °C 1200 و زمان 300 دقیقه انجام گردید که در نتیجه­ی آن، منطقه متاثر از نفوذ حذف و ریزساختار کاملاً همگن و عاری از رسوبات بوریدی سوزنی و بلوکی تشکیل شد.

کلیدواژه‌ها


عنوان مقاله [English]

Effect of bonding time and temperature on microstructure of GTD-111/ BNi-3 /GTD-111 system during the Transient Liquid Phase (TLP)

نویسندگان [English]

  • Seyed Abdolkarim Sajjadi 1
  • Javad Asadi 2
  • Hamid Omidvar 3
1 material & metallurgy engineering , Ferdowsi university, Mashhad, Iran
2 Materials Science and Engineering, Engineering, Ferdowsi University of Mashhad, Mashhad, Iran
3 Mining and Metallurgical Engineering, Amirkabir University of Technology (Tehran Polytechnic), Tehran, Iran
چکیده [English]

In this paper, the effect of bonding temperature and time on the microstructure of transient liquid phase bonding of GTD-111 nickel-based superalloy was studied. The bonding process was performed at temperatures of 1080, 1120 and 1160 °C at different times and the microstructure of the various bonding regions was analyzed by light and scanning electron microscopy. The results show that by increasing the bonding temperature from 1080 to 1160 °C, solidification time was reduced from 195 to 90 min and the dissolution rate of the base metal and the bonding width increased. Also, at all holding times, the bonding zone containing secondary phases included nickel-rich and chromium-rich borides and nickel silicide in a  matrix. These phases were observed in the centerline and adjacent of the interface. By increasing the bonding time, the volume fraction of the precipitates in the bonding zone decreased and the brittle boride phases were completely removed. This process is due to the strong dependence of the diffusional behavior of the TLP-joint on temperature and time. It was observed that with increasing the bonding temperature, the bonding width and the rate of dissolution of the base metal increase. The results showed that with increasing holding time at all three bonding temperatures, the thickness of the ASZ zone and the volume fraction of precipitates in the bonding area decreased and the DAZ width increased.

کلیدواژه‌ها [English]

  • isothermal solidification
  • nickel-based superalloy
  • ASZ
  • DAZ
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