The Study of the Effects Intermetallic Phases Formation on the Bond Strength and Electrical Resistivity of Al/Cu Bimetal produced by Compound Static Casting

Document Type : Research Paper

Authors

• S Tavassoli
• M Abbasi
• R Tahavvori

Abstract

In this investigation the Al/Cu bimetals were produced by compound casting method. The effect of aluminum melt pouring temperature and copper preheating on bond strength were assessed. The thickness, microstructure and composition of Al/Cu intermetallic compounds (IMCs) were characterized by optical microscope (OM) and electron probe micro-analyzer (EPMA). The results show that the interface of Al/Cu bimetal consists of α-Al2Cu eutectic structure, a thin layer of Al2Cu and a thin multilayer includes of AlCu, Al3Cu4, Al2Cu3, Al4Cu9. Raising the Al melt pouring temperature and preheating solid Cu leads to increase of the IMCs thickness at interface and consequently increases the specific electrical resistance and decreases the Al/Cu bond strength. The electrical resistance of Al/Cu bimetals were higher compared to theoretical calculation. The samples bond peeling strength were decreased by increasing the thickness of intermetallic compounds layers. It is founded that both curves of bond strength versus IMCs thickness for cold roll welded samples and compound casting samples have similar trends when bond strength is lower than 120 N/cm.v

Keywords

• Compound casting
• Al-Cu bimetal
• Intermetallic Compounds
• bond strength
• electrical resistivity

20.1001.1.22285946.1396.7.27.3.5

---

References

1-J.Xie, Ch.Wu, Liu, "A Novel Forming Process of Copper Cladding Aluminum Composite Materials with Core-Filling Continuous Casting”, Materials Science Forum, Vol. 539-543, pp 956-961, 2007.

2-R. Uscinowicz, “Impact of temperature on shear strength of single lap Al–Cu bimetallic joint ", Composites, Vol.44, PP.344-356, 2013.

3-A.Khosravifard, R.Ebrahimi, "Investigation of parameters affecting interface strength in Al/Cu clad bimetal rod extrusion process", Materials and Design, Vol. 31, pp.493–499, 2010.

4-G.R.Zare, M.Divandari, H.Arabi,  “Investigation on interface of Al/Cu couples in compound casting”,  Materials Science and Technology, Vol. 29, pp.190-196 , 2013.

 

5-H.Liu, F.J.Ke, H.Pan, Acta Physica Sinica, "Molecular Dynamics Simulation of the Diffusion Bonding and Tensile Behavior af a Cu-Al Interface", Vol.56(1), pp.407 [in Chinese] , 2007.      

6-WA.Owczarski, DF.Paulonis, "Application of Diffusion Welding in the USA", Welding J. , Vol.62, pp.22 , 1981.

 

 

7-K.S.Lee, Y.N. Kwon, "Solid-state bonding between Al and Cu by vacuum hot pressing", Trans. Nonferrous Met. Soc. China, Vol. 23, pp.341−346, 2013.

8-E. Hug, N. Bellido, " Brittleness study of intermetallic (Cu, Al) layers in copper-clad aluminium thin wires", Materials Science and Engineering A, Vol.528, pp7103– 7106, 2011.

9-S.Lee, M.G.Lee, S.P. Lee, G.A. Lee, Y.B. Kim, J.S.Lee, D.S.Bae, "Effect of bonding interface on delamination behavior of drawn Cu/Al bar clad material", Trans. Nonferrous Met. Soc. China, Vol.22, pp.s645−s649, 2012.

10-M.Abbasi, A.Karimitaheri, M.T.Salehi. “Growth rate of intermetallic compounds in Al/Cu bimetal produced by cold roll welding process “, Journal of Alloys and Compounds, Vol.319, pp.233-241, 2001.

11-L.Y. Sheng, F. Yang, T.F. Xi, C. Lai, H.Q. Ye, "Influence of heat treatment on interface of Cu/Al bimetal composite fabricated by cold rolling”, Composites, Vol 42, Part B, pp.1468-1473, 2011.

12-Chen, Hwang, "Effect of Annealing on the Interfacial Structure of Aluminum-Copper Joints", Materials Transactions, Vol. 48, No. 7, pp.1938-1947, 2007.

13-B. Avitzur, "Handbook of Metal forming processes", Wiley, New York, 1983.

14-P.Kazanowski, M. E.Epler, W. Z.Misiolek, "Bimetal rod extrusion-process and product optimization", Journal of Materials Science and Engineering A, Vol.369, pp.170-180, 2004.        

15-J.T.Luo, S.Zhao, C.H. Zhang, “Casting−cold extrusion of Al/Cu clad composite by copper tubes with different sketch sections”, J. Cent. South Univ., Vol.19, pp.882−886, 2012.

 

16-ح. بختیاری، م. خانزاده قره شیران، ع.ا اکبری موسوی، " تاثیر عملیات حرارتی بر ترکیبات بین فلزی فصل مشترک جوش انفجاری فولاد زنگ نزن 321 به آلومینیم 12"، مجله مواد نوین، جلد 5، شماره 4، تابستان 1394.

17-S.Bereski, Z.Stradomeski, “quality of bimetallic Al-Cu joint after explosive cladding”, Journal of achievement in materials, Vol.22, pp.73-76 , 2007.

18-ASM metals handbook. Alloy phase diagram, vol. 3. Ohio: ASM International -1992.

19-H.Xu , C.Liu , V.V.Silberschmidt , S.S. Pramana , T.J. White , Z. Chen , V.L. Acoff , "Behavior of aluminum oxide, intermetallics and voids in Cu–Al wire bonds",Acta Materialia, Vol. 59, pp.5661–5673, 2011.      

20-M. Divandari, A.R. Vahid Golpayegani, " Study of Al/Cu rich phases formed in A356 alloy by inserting Cu wire in pattern in LFC process", Materials and Design, Vol.30, pp.3279–3285 , 2009.

21-A.R.Vahid Golpayegani, M.Divandari “An investigation on the production of casting composite via lost foam process”, J Iranian Foundrymen’s Soc , Vol.82, 26th Year, [Rikhtegary, in Persian with English abstract], 2006.  

22-D.Moreno, J.Garrett, J.D.Embury “A technique for rapid characterization of intermetallics and interfaces”, Intermetallics, Vol.7, pp-1001-1009 , 1999.

23-H.Liang, Z. Xue, C. Wu, Q. Liu , Y. Wu, "Research on continuous core-filling casting forming process of copper-clad aluminum bimetal composite material", Acta Metall. Sin.Vol.23 No.3 pp206-214 June 2010.           

24-S.Chen , F.Ke, M. Zhou, Y. Bai ," Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al", Acta Materialia, Vol.55, pp.3169–3175, 2007.

25-Y. Dua, Y.A. Changb, B. Huanga , “Diffusion coefficients of some solutes in fcc and liquid Al:critical evaluation and correlation “ , Materials Science and Engineering A. Vol.363, pp.140–151, 2003.

26-J.Rayen, M. Sherer, C. Bauser ,
“Investigation of Interfacial Reaction in Thin Couples of Aluminum and Copper”, J. Thin Solid Film, Vol. 65, pp. 381-391, 1980.