Investigating on effect of heat treatment on microstructure and metallurgical properties of three layers explosively bonded Cu/Al/Cu plates

Document Type : Research Paper

Authors

Abstract

       In this study, the microstructure and mechanical properties of  Cu/Al/Cu explosively bonded plates interface after heat treatment were discussed. To illustrate the effect of temperature and time, welded samples at temperatures 300°C and 400 °C in times of 30 minutes and 20 hours heat treated. With the heat treatment for 30 minutes At temperature of 300°C, 30 minutes At temperature of 400°C and 20 hours At temperature of 300°C, respectively average thickness of the the interfacial layer in upper interface was increased from 37/144, 27/232 and 82/33 microns to 39/285, 33/987 and 95/834 microns and at the lower interface, thickness was increased from 20/967, 16/992 and 43/979 microns to 22/12, 22/76 and 52 microns.The micro-hardness of diffusion layer at the upper interface  was decreased respectively from 508/8, 436/2 and 393/9 Vickers to 258/9, 296/7 and 293/9 Vickers and at the Lower interface was decreased from 321/3,321 and 248/7 Vickers to 2213/, 185/8 and 162/3 Vickers. The results showed that the thickness of the interfacial layer had a direct relationship to the temperature and duration of heat treatment. So that by applying heat treatment on the samples, the thickness of intermetallic compounds is increased compared to pre-heat treatment and this increase was higher in the upper joint.

Keywords


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