Production of Open Cell Copper Foam and assessment of foam Substructure

Document Type : Research Paper

Authors

• M Shahsavan
• S.M.H Mirbagheri

Asso.pfrof./ amirkabir university

Abstract

The aim of this study is to provide a method of making ultralight open cell copper foam with high surface area using chemical procedures. Among the various methods of making open-cell metal foams, electrodeposition method is selected because it can be done in a clean way and is cheaper than other methods. In this method, an open cell polyurethane sponge was used as substrate. Then by choosing appropriate chemical solutions with specific technical knowledge, first polyurethane surface has activated and then by electroless-deposition method, polyurethane activated surface covered with a thin layer of copper. In the final stage, with the aid of electrodeposition the thickness of copper layer was increased to the desired thickness with a minimum required strength. The results show that electrodeposition can increase the thickness of copper layer from3-5 microns that is obtained in electroless-deposition method to above100 to 150 microns. SEM results show that the micro structure of the deposited layer is globular. By controlling the thickness of deposited copper in electroplating, the surface area of the copper foam can be increased. According to results optimum time for electroless-deposition is between 5 to 7 minutes and for electrodeposition is 1 hour. The open-cell copper foam that is produced in this research is ultralight and due to it high surface can transfer heat with high rates.

Keywords

• Polyurethane foam
• Electroplating
• Electroless-plating
• Open-cell copper foam
• Characteristic area

20.1001.1.22285946.1397.8.31.1.8

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